Expert Interview ｜ Tian Yanhong: The third -generation semiconductor has hopes to become a pioneer in my country

"my country's electronic packaging field is relatively leading internationally, and the third -generation semiconductor industry is now in the third -generation semiconductor industry. my country's patent in the third -generation semiconductor industry has surpassed developed countries. Therefore The pioneer of breakout. "On the 9th, the Harbin Institute of Technology Innovation Seminar at the World 5G Conference Semiconductor Materials Industry Innovation Seminar, a professor at the School of Materials Science and Engineering of the University of Technology, and the deputy director of the National Key Laboratory of the National Key Laboratory of the National Key Laboratory of the National Key Laboratory of the National Key Laboratory. Expenses.

Tian Yanhong

Tian Yanhong introduced that there are still some technical bottlenecks in the development of the third -generation semiconductor industry in my country, such as chip manufacturing, packaging materials development, and integrated packaging thermal management. For the development of the semiconductor industry, Heilongjiang has great potential. For example, there are companies that focus on semiconductor equipment research and development, substrate manufacturing, and device design, and Jiangfeng Electronics such as high -purity targets. At the same time, Harbin Institute of Technology has a good foundation in semiconductor device materials, packaging, etc., and Harbin Institute of Technology's microelectronics and the advanced welding of the School of Materials have good technical accumulation.

"my country is in the international forefront in the field of packaging. To this end, new breakthroughs and innovations can be achieved in the field of packaging, especially electronic packaging. Now the integrated circuit has developed to 7 nanometers and 3 nm. With the decline in performance, we can improve the overall performance through system -level packaging methods, so packaging is a very good field of realizing integrated circuits in our country. "Tian Yanhong said that the World 5G conference was held, we Able to communicate and cooperate with more industry experts and industry experts, so as to better promote the development of third -generation semiconductors in Heilongjiang Industrial.

Source: Lottery News

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