Early Asset Road | Digital RMB Industry Alliance is established; Huawei Hu Houkun: In the next three years, the penetration rate of the intelligent computing industry will exceed 40%

Digital RMB Industry Alliance Establishment

From July 23rd to 24th, the Fifth Digital China Construction Summit was held in Fuzhou, Fujian Province. On the morning of the 24th, the "Digital RMB Industry Alliance" jointly initiated by New World Digital Technology Co., Ltd. and Huawei Technology Co., Ltd. held an election conference and elected Wang Jing, chairman of New World as the first chairman of the Alliance, and the new mainland as the chairman of the alliance. Essence As of now, the alliance includes 37 member units, including a number of large state -owned banks.

Honor CEO Zhao Ming: The ecology of the whole scene should be human -centered and will build an open ecosystem

Recently, Honor CEO Zhao Ming said, "Building a smart life solution for human -oriented, across applications and across equipment, bringing consumers a richer glory full scene experience." The goal of glory is to create an open ecosystem, open standards, technology and platform capabilities to partners, to achieve extensive coverage of the entire scene equipment, and to meet the needs of multi -product, multi -brand terminals, and multi -scenario needs of users.

Huawei Hu Houkun: In the next three years, intelligent computing industry penetration rates will exceed 40%

On July 24, Hua Kun, the chairman of Huawei's rotating chairman, said that in the next three years, the parameters of large artificial intelligence models will develop from 100 billion levels to trillion levels. The penetration rate of marginal intelligent computing will exceed 40%. Hu Houkun also pointed out that the current digital talent gap in my country has exceeded 11 million. In the next three years, it will cultivate more than 3 million new types of computing talents through the integration of production and education, collaborative education.

Tencent: It will focus on supporting 10 digital rural pilot areas

Zhang Lijun, Vice President of Tencent and General Manager of East China Headquarters, said on July 23 that Tencent will implement the relevant requirements of the "Essentials of Digital Rural Development in 2022" and participate in the "China Internet Development Foundation Digital Development Special Fund" project, focusing on support 10 pilot areas to explore the experience of digital rural construction.

Chinese scientists have discovered "best semiconductor materials" so far

On July 22, the scientific research team from Massachusetts Institute of Technology, Houston University and other institutions discovered a material called "cubic arsenic boron". Excellent conductivity and also have extremely high thermal conductivity. Scientists said that this is the best semiconductor material discovered so far, and perhaps the best one will be the best in the future. Related results have been published in the recent "Science" magazine. The author column includes many Chinese, such as Chen Gang, a professor of mechanical engineering at Massachusetts Institute of Technology, and Ren Zhifeng (University of Houston).

The number of Chinese unicorn companies is second in the world

On July 23, according to statistics from CB Insights, as of February 2022, the total number of unicorn companies with a global valuation of more than $ 1 billion or more exceeded 1,000. The first five unicorn number is the United States, China, India, the United Kingdom and South Korea. Among them, the number of unicorn between China and the United States accounted for more than 70%. The list shows that as of April 2022, there were 356 unicorn in China, with a total valuation of 9.4 trillion yuan.

TSMC's 3nm process process is expected to mass production this month, and the production capacity will be improved smoothly next year

According to reports, Samsung Electronics has announced on the official website on June 30 that they have adopted a 3nm process process of the full -ring winding grille crystal architecture, which has initially produced chips on the same day. The first batch of chips has been shipped on July 25.

Intel high -end graphics card announced, up to 16GB, 3060Ti level

Intel announced in its community the high -end models of the ARC graphics family, including A770 16GB and A750 8GB. Intel said that the graphics card is currently sampled and will send the media test to the media and give it to the winner of the Xe-HPG treasure hunt game this summer.

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