ICEPT2022 International Electronic Packaging Technology Conference was successfully held

On August 9th, the 23rd International Electronic Packaging Technology Conference (Icept2022) opened at the hotel in Jindi Beach, Dalian. The meeting was hosted by the Institute of Microelectronics of the Chinese Academy of Sciences, Dalian University of Technology, Dalian Jinpu New District Management Committee, the International Electronics Electronics Engineer Association Electronic Packaging Institute (IEEE-EPS) and the Cie-EMPT of Electronic Manufacturing and Packaging Technology (CIE-EMPT) , Organized by the School of Microelectronics, Dalian University of Technology. Professor Luo Zhongyi, deputy president of Dalian University of Technology, Researcher Ye Tianchun, chairman of the conference, and Lu Dongsheng, deputy secretary of the Party Working Committee and deputy director of the management committee of the Jinpu New District, attended the opening ceremony and delivered a speech. At this conference, Dr. Kitty Pearsall, chairman of IEEE-EPS, Mr. Zheng Li, CEO of Changdian Technology, Hisilicon Semiconductor packaging design senior technical expert, Dr. Zheng Jiantao and Intel Vice President, Intel Semiconductor Storage Technology (Dalian) Co., Ltd. Store R & D Center Dr. Chen Weidong and over 500 professionals from universities, research institutions, and electronic packaging manufacturers from domestic and foreign universities, research institutions, and electronic packaging manufacturing have attracted more than 7,400 online audiences. Professor Liang Hongwei, deputy dean of Dalian University of Technology, served as chairman of the technical committee of the conference and presided over the report.

In his speech, Luo Jong -hyun warmly welcomed the arrival of leaders and experts in the participating schools, and introduced the school's development results in recent years. He said that the Microelectronics Academy is actively obtaining the hosting rights of the ICEPT2022 conference. It will take this as an opportunity to promote the construction of an industry -university -research exchange platform for integrated circuits related disciplines, give full play to the advantages of relevant disciplines, promote the development of local industries, and help the local economy improvement; The key technologies of the integrated circuit industry carry out collaborative innovation. They are one of the industrial foundations and development advantages of Dalian and Jinpu New District with Dalian and Jinpu New District. The integration and development of major projects and high -end talents will be promoted.

In the background of the Moore era, semiconductor manufacturing technology faced challenges, new technologies continued to emerge, and the position of advanced packaging in the industrial chain became increasingly important. The ICEPT conference is one of the four major brand conferences in the international electronic packaging field, and has successfully held 23 sessions. After the opening ceremony, the meeting adopted the latest progress in the fields of theme forums, branches reports, special lectures, special reports, exhibitions and exhibition papers, and other forms.

News source: Dalian University of Technology News Network

Edit: Qian Han Yunyun

School pair: Li Yixun

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