"Semiconductor" completes 700 million yuan A+round of financing

Huntyun News September 22 news shows that the driver IC covering thin film packaging substrate (COF) supplier Jiangsu Shangda Semiconduction Co., Ltd. completed 700 million yuan A+round of financing. The manufacturing transformation and upgrading of the new Material Fund jointly led the investment. According to reports, this round of financing will be mainly used in technology research and development, new production capacity, and localization of supply chain.

According to the smart bud science and innovation evaluation platform, the science and technology innovation capabilities of the "Semiconductor" in the electronic core industry is rated into A -level. At present, there are 150 patent applications, which are mainly focused on lineboards and light -engraved glue.

According to the data, it is established in 2017. It is a supplier that shows the driver's IC -filled film packaging substrate, which mainly produces high -precision ultra -thin flexible packaging substrates and integrated circuits. Specifically, it mainly covers high -precision ultra -thin flexible packaging substrates, large -scale integrated circuits, electronic components research and development, production, sales and technical consulting, technical services, roll -type flexible IC load connection chips, semiconductor materials and components, components and components Packaging and testing business.

The so -called COF is a grain soft film installation technology that fixes integrated circuits on a flexible circuit board. It uses a soft additional circuit board as a packaging chip carrier to combine the chip and soft substrate circuit, or the soft single finger without packaging chip. Additional circuit boards include roll -up packaging production (TAB substrate, which are called TCP), soft board connection chip components, and soft IC carrier panel packaging.

It is worth mentioning that although COF is an emerging IC packaging technology, its process process is compatible with traditional FPC and IC installation technology. The production of fine lines is increased with the decrease in the pitch of the chip installation and the increase of the number of I/O. The requirements for fine line graphics are also increasing, and the line width and spacing are less than 50 μm fine graphics.

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