The opening of the optoelectronics chip sealing and testing platform enables

The calculation speed is about 1,000 times faster than the electronic chip, but the power consumption can be lower -photonic chip is becoming a cutting -edge industry for the current layout. The reporter recently learned that at the Beijing Electronics City IC/PIC Innovation Center, the first phase of the optoelectronics chip packaging test verification platform has been completed, and the basic test capacity of the optical chip is initially equipped, which can provide support for the research and development and industrialization of start -up enterprises.

"Change the road" breaks through the transistor restriction

The performance improvement of traditional electronic chips mainly depends on the size of the internal unit transistor, so as to place more transistors in the unit area as much as possible. Under normal circumstances, the more the number of transistors integrated by the chip, the stronger the chip computing power. However, due to the limitations of processing accuracy, traditional technical routes are facing bottlenecks. In order to improve the computing power and break through the bottleneck, through the study of the physical transformation of the optical signal in the process of transmission, the calculation function has become a new breakthrough direction.

"Ideally, the calculation speed of photon chip is about 1,000 times faster than the electronic chip, and the power consumption is lower. It can break through the limitation of Moore's law in terms of performance." Said Bai Bing, founder of photonic calculation technology.

The characteristics of photoelectric chips have provided good opportunities for the "overtaking" of related industries in my country. Light computing chips are different from the principle of electronic chip. They do not rely on transistor optimization. Instead, through the principle of photoelectric conversion, use optical signals to spread faster, lower power consumption, and non -electromagnetic interference. Complete specific calculation tasks. At the same time, the entire process of the manufacturing process of photon chips can be achieved in China, and the level of technology as foreign countries is basically on the same starting line.

Old factory building becomes a "core" space

In the "Several Measures of Beijing on Promoting High -end Intelligent Green Development in Promoting High -end Industrial Investment and Promoting Manufacturing Industry Investment" released in 2021, it clearly proposed that the future cutting -edge industries in the field of optoelectronics and other fields should be proposed.

In 2021, under the leadership of the Electronic City IC/PIC Innovation Center of Yantong Micro Electronics 6 -inch wafer manufacturers, under the leadership of the technology service operator electronics city Hi -Tech, provided more "Chuangxinli" scientific research team and enterprise to grow With the space offei. Sun Honglan, the deputy general manager of the Electronic City IC/PIC Innovation Center and deputy general manager of the Beijing Electronic City Integrated Circuit Design Service Company, introduced that Jiuxianqiao area is the earliest electronic industrial base in China. Now through update and transformation, it has been a single electronic industry gathering area in the past. It is an important part of the self -innovation demonstration zone of Zhongguancun State.

Preliminary test packaging ability

At the same time as the old factory building is transformed, the park also considers the needs of the research team and startups. Like traditional electronic chips, photoelectric chips, before pushing to market applications, need to verify the verification and test of chips and small -scale trial production. It is difficult to provide a customized packaging plan for new demand for the development and processing of samples. This undoubtedly increases the waiting time and processing costs of the startup team.

With the joint efforts of the electronic city high -department and photons, in 2022, the first stage of the optoelectronics chip packaging test verification platform was completed at the Electronic City IC/PIC Innovation Center. At present, the platform has completed the infrastructure transformation and cleanliness construction of the initial stage, and has initially possessed the basic test packaging capacity of optical chip. (Source: Beijing Daily)

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