Building 5G ecology to promote the Communist Party of Communist Party · Gfenist Views 丨 Tian Yanhong's third -generation semiconductor is expected to become a pioneer in my country

Reporter Liu Xiang, Liu Xiang

□ Our reporter Li Aimin

"my country's electronic packaging field is relatively leading internationally, and the third -generation semiconductor industry is now in the third -generation semiconductor industry. my country's patent in the third -generation semiconductor industry has surpassed developed countries. The third -generation semiconductor is very hopeful to become an urgency for breakouts in my country. Pioneer. "On the 9th, the Harbin Institute of Technology Institute of Materials Science and Engineering, a semiconductor material industry innovation seminar at the World 5G Conference, and the deputy director of the National Key Laboratory of the National Key Laboratory of the National School of Materials Science and Engineering, explained the development of my country's semiconductor industry and future development. point.

Tian Yanhong introduced that there are still some technical bottlenecks in the development of the third -generation semiconductor industry in my country, such as chip manufacturing, packaging materials development and integrated packaging thermal management. For the development of the semiconductor industry, Heilongjiang has great potential. For example, there are companies that focus on semiconductor equipment research and development, substrate manufacturing, and device design, and Jiangfeng Electronics such as high -purity targets. At the same time, Harbin Institute of Technology has a good foundation in terms of semiconductor device materials, packaging, etc., and Harbin Institute of Technology's microelectronics and the advanced welding of the School of Materials have very good technical accumulation.

"my country is in the international forefront in the field of packaging. For this reason, new breakthroughs and innovations can be achieved in the field of packaging, especially electronic packaging. After the integrated circuit develops to 7 nanometers and 3 nanometers, if the node is reducing the nodes, the cost, performance, performance, performance Decrease. You can improve the overall performance through system -level packaging methods, so packaging is a field that can realize integrated circuits. "Tian Yanhong said that the World 5G conference was held, we can follow more industry experts and industry experts. Exchange and cooperation, so as to better promote the development of third -generation semiconductors in the Heilongjiang industry.

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