"Zhongke Zhixin" completed the B1 round of financing

According to the news on the 6th, Jiangsu Zhongke Zhixin Integrated Technology Co., Ltd. completed a new round of financing and directly incorporated the cash over 150 million yuan. Complete. It is reported that this round of financing funds will be mainly used for wafer -level advanced packaging related equipment.

According to the company's information, China Science and Technology was established in 2018. It is a typical model for the country's central city integrated circuit and ICT industrial base for the central city of Huaihai Economic Business District. Zhongke Zhixin has rich experience in the field of semiconductor advanced packaging, such as fan -out, fan, chip inverted, stacked packaging, and silicon -hole hole. It has a high degree of maturity in projects implemented since the establishment of the company. With the demand for various big data, wearables, mobile electronic devices, and high -end communication, the wafer -level fan -out packaging technology has become more and more valued due to its cost -effective advantage. This is also the main development and production of Zhongke Zhixin. The focus.

The technical services owned by Zhongke Zhixin include convex technology, wafer -grade fan -entered packaging, wafer -level fan out package, DPS technology, test structured services, etc. Relying on its technical innovation and mature experience, Zhongke Zhixin provides services including packaging stack structure design, mask graphics design, system module design, signal integrity simulation, structural stress and thermal simulation, mechanical warranty simulation and other services and other services. Essence The financing will also be based on advanced packaging, and the overall industrial chain of the overall industrial chain of design, lightwear, simulation, wafer -level process, test analysis, and micro -assembly according to customer needs.

The smart bud TFFI science and technology innovation assessment platform shows that there are more than 30 patent applications in China Science and Technology, of which about 80%of the invention patents. The company's patent layout is mainly focused on the encapsulation structure, wafer -level packaging and other related fields.

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